@phaedrux hello, yes I am using a expansion board, and I am still on firmware 3.4.0beta1, I will upgrade now. here is my full config.
; Configuration file for Duet 3 (firmware version 3)
; executed by the firmware on start-up
;
; generated by RepRapFirmware Configuration Tool v3.2.3 on Tue Jun 08 2021 13:20:30 GMT+1200 (New Zealand Standard Time)
; General preferences
G90 ; send absolute coordinates...
M83 ; ...but relative extruder moves
M550 P"Duet 3" ; set printer name
M669 K1 ; select CoreXY mode
; Drives
M569 P0.0 S1 ; physical drive 0.0 goes forwards X
M569 P0.1 S1 ; physical drive 0.1 goes forwards Y
M569 P0.2 S1 ; physical drive 0.2 goes forwards Z0
M569 P0.3 S0 ; physical drive 0.2 goes forwards Z1
M569 P0.4 S1 ; physical drive 0.2 goes forwards Z2
M569 P0.5 S0 ; physical drive 0.2 goes forwards Z3
M569 P1.0 S1 ; physical drive 1.0 goes forwards Extruder
M584 X0.0 Y0.1 Z0.2:0.3:0.4:0.5 E1.0 ; set drive mapping
M350 X16 Y16 Z16 E16 I1 ; configure microstepping with interpolation
M92 X80.00 Y80.00 Z400.00 E429 ; set steps per mm
M566 X900.00 Y900.00 Z60.00 E120 ; set maximum instantaneous speed changes (mm/min)
M203 X18000.00 Y18000.00 Z3000 E15000 ; set maximum speeds (mm/min)
M201 X2000 Y2000 Z250 E1800 ; set accelerations (mm/s^2)
M204 P1500 T2000
M906 X1200 Y1200 Z1000 E1000 I30 ; set motor currents (mA) and motor idle factor in per cent
M84 S30 ; Set idle timeout
; Axis Limits
M208 X0 Y0 Z0 S1 ; set axis minima
M208 X350 Y355 Z280 S0 ; set axis maxima
; Endstops
M574 X2 S1 P"^io1.in" ; configure active-high endstop for high end on X via pin !^io1.in
M574 Y2 S1 P"^io2.in" ; configure active-high endstop for high end on Y via pin !^io2.in
M574 Z0 S1 P"nil"
; Z-Probe
M558 K0 P8 C"^io4.in" T18000 F120 H5 A5 S0.01 R0.2
G31 K0 P500 X0 Y23.5 Z1.822 ; Don't really care about inductive probe Z offset
M558 K1 P8 C"^io3.in" T18000 F120 H2 A10 S0.005 R0.2
G31 K1 P500 X0 Y0 Z0.70 ; Z switch offset (if positive, greater value = lower nozzle. if negative, more negative = higher nozzle)
;at 60°C Z=0. at 100°C Z = ; at 70° Z = 0.70
M671 X-58:-58:420:420 Y0:421:421:0 S10
M557 X25:325 Y25:325 S25 ; define mesh grid
; Heaters
M308 S0 A"Bed heater" P"temp0" Y"thermistor" T100000 B3950 ; configure sensor 0 as thermistor on pin temp0
M308 S2 A"Bed plate" P"temp1" Y"thermistor" T100000 B4725 C7.06e-8
M950 H0 C"out1" T2 ; create bed heater output on out1 and map it to sensor 2
M307 H0 B0 S1.00 ; disable bang-bang mode for the bed heater and set PWM limit
M140 P0 H0 ; map heated bed to heater 1
M143 H0 P1 T0 A2 S115 C0
M143 H0 P2 T2 A1 S110 C0
M143 H0 S110 ; set temperature limit for heater 1 to 110C
M308 S1 A"Hotend" P"1.temp0" Y"thermistor" T100000 B4725 C7.06e-8 ; configure sensor 1 as PT1000 on pin 1.temp0
M950 H1 C"1.out0" T1 ; create nozzle heater output on 1.out0 and map it to sensor 1
M307 H1 B0 S1.00 ; disable bang-bang mode for heater and set PWM limit
M143 H1 S350 ; set temperature limit for heater 0 to 350C
; Fans
M950 F0 C"1.out6" Q250 ; create fan 0 on pin 1.out6 and set its frequency
M106 P0 S0 H-1 ; set fan 0 value. Thermostatic control is turned off
M950 F1 C"1.out7" Q20 ; create fan 1 on pin 1.out7 and set its frequency
M106 P1 S1 H1 T45 ; set fan 1 value. Thermostatic control is turned on
M308 S3 Y"mcu-temp" A"MCU"
M308 S4 Y"drivers" A"DIVERS"
M950 F2 C"out7" Q30
M950 F3 C"out8" Q30
M106 P2 S1 H3:4 T50 C"MCU"
M106 P3 S1 H3:4 T50 C"MCU"
; Tools
M563 P0 S"Hotend" D0 H1 F0 ; define tool 0
G10 P0 X0 Y0 Z0 ; set tool 0 axis offsets
G10 P0 R0 S0 ; set initial tool 0 active and standby temperatures to 0C
; Custom settings are not defined
; Miscellaneous
M575 P1 S1 B57600 ; enable support for PanelDue
M501 ; load saved parameters from non-volatile memory
M911 S10 R11 P"M913 X0 Y0 G91 M83 G1 Z3 E-5 F1000" ; set voltage thresholds and actions to run on power loss
T0 ; select first tool
M572 D0 S0.075 ; Pressure Advance PLA 0.075 PETG 0.2
M592 D0 A0.015 B0.0012 L0.2 ; Non-linear extrusion
M376 H10 ; Fade mesh out compensation over 10mm Z